Engineering professionals in Semiconductors

Experience: Director of Process Engineering · Micron Technology

Director of Process Engineering at Micron Technology since 2024. The highlight covers dry etch, wet process and CMP and describes managing senior process and hardware engineers on logic and memory manufacturing technology, including FE gate and BE interconnect materials, process flow and integration. Other listed roles include Dry Etch Department Manager at Intel (2022–2024), Director of Dry Etch Technology Development at Intel (2021–2023) and Engineering Manager at Intel (2015–2019).

Experience: Director Technology transfer and Integration Engineering · GlobalFoundries

Former Director Technology transfer and Integration Engineering at GlobalFoundries (2022–2025) and Director Integration Engineering and Yield at GlobalFoundries (2019–2021). Senior Director Operations at Black Semiconductor since 2026. The highlight describes nearly 20 years across the semiconductor manufacturing lifecycle, including technology transfer, process integration, yield enhancement and new product introduction. Other listed roles include Director Manufacturing Expansion and Ramp management at GlobalFoundries (2021–2022).

Experience: Director of Product Engineering · Systems on Silicon Manufacturing Company Pte Ltd (SSMC)

Director of Product Engineering at Systems on Silicon Manufacturing Company Pte Ltd (SSMC) since 2025. The highlight describes more than 25 years in the semiconductor industry spanning technology development, process integration, process transfer, product engineering and yield improvement. Other listed roles include Director, Technology Development (2020–2025) and Deputy Director, Technology Development (2017–2020) at the same company, and Manager, Process Integration at GlobalFoundries (2013–2017).

Experience: Director Of Process Engineering · Qorvo, Inc.

Director Of Process Engineering at Qorvo, Inc. since 2016. The highlight describes an engineer with 36+ years of technical management and responsibility for BAW filter process technologies. Other listed roles include Director of Yield and CMOS Integration- Logic Technologies Ramp at Intel (2005–2016) and Senior Yield Engineering Manager, Intel Fab20 in Oregon at Intel (2002–2005).

Experience: Director Engineering Etch and Lithpgraphy · Black Semiconductor

Director Engineering Etch and Lithpgraphy at Black Semiconductor since 2025. The highlight describes planning, developing, implementing and maintaining semiconductor manufacturing processes from startup through ramp into high volume manufacturing, as well as specialty low volume technologies. Other listed roles include Silicon Development Engineer Member of Technical Staff at onsemi (2024–2025), Silicon Development Engineering Manager at onsemi (2023–2024) and Process Development Director at Крокус Наноэлектроника / Crocus Nano Electronics (2017–2022).

Experience: Sr. Director of Engineering ATD · Lam Research

Sr. Director of Engineering ATD at Lam Research since 2021. The highlight describes senior technical management in semiconductor capital equipment, taking products from concept and feasibility through alpha and beta to full customer deployment. Other listed roles include Sr. Dir ALD CVD Metals C&F Direct Metals BU at Lam Research (2018–2021), Director of Engineering DPG Advanced Gap Fill at Lam Research (2014–2018) and VP of Engineering at Scifiniti (formerly iPV) (2013–2014).

Experience: Head of Engineering, MDP and ALD Business Units · Applied Materials

Head of Engineering, MDP and ALD Business Units at Applied Materials since 2025. The highlight describes more than 20 years leading cross-functional product development teams in areas including ALD, PEALD, CVD and PECVD. Other listed roles include Senior Director of Engineering at Applied Materials (2016–2021), Engineering Director at Applied Materials (2013–2015), Engineering Manager at Applied Materials (2008–2012) and Lead Design Engineer at Applied Materials (2006–2007).

Experience: Engineering Manager · NXP Semiconductors

Engineering Manager at NXP Semiconductors since 2022. The highlight describes an engineering leader in electronics and semiconductor manufacturing, from R&D to production and high-volume factory ramp, focused on yield, cost and technology. Other listed roles include Director Of Engineering at FlipChip International (2018–2019), Engineering Manager at Cree (2017–2018) and Engineering Manager at Intel (1995–2017).

Experience: Senior Director of Engineering, Sr. Principal Engineer · Intel

Senior Director of Engineering, Sr. Principal Engineer at Intel since 2024. The highlight describes delivering semiconductor process technologies across the lifecycle from early development to high-volume manufacturing (HVM) transfer and sustaining. Other listed roles include Director of Engineering, Principal Engineer at Intel (2018–2024), Technology Development Engineering Manager at Intel (2014–2018), Senior Staff TD Engineer at Intel (2011–2014) and Staff Process TD Engineer at Intel (2008–2011).

Experience: Director of Engineering - North America Europe · EMD Electronics

Director of Engineering - North America Europe at EMD Electronics since 2025. The highlight describes a focus on manufacturing scale-up and operational excellence and describes EMD Electronics as a semiconductor manufacturing company. Other listed roles include Sr. Manager, Process Engineering at Form Energy (2025), WATD Engineering Manager at Intel (2023–2025) and LTD Etch Ash Engineering Manager at Intel (2022–2023).